Chemical Solutions

清潔印刷油墨及導電銀膠 / 清洗設備分解污染物 / 硬化可剝離不殘膠

Washing trough agent

In the PCB production process, there are processes such as solder mask, dry film, etc. Due to the dissolution of resin over a long period of time, it causes dirt and other materials on the equipment, thus causing residual pollutants on the nozzles and rollers, which affects the efficiency and output of the equipment.

EC-200 non-ionic cleaning agent can completely solve this problem, cleaning equipment can be broken down its pollutants, immediately restore production efficiency, and easy to operate.

•Developer tank cleaning.

•Related tank cleaning.

Defoamer

The more dense PCB process line causes the resin structure of dry film to become more and more delicate, so in the process of developing or de-filming, the foam becomes more and more difficult to handle.

Defoamer uses water as the solvent, which can be evenly distributed in all corners of the tank bath to achieve the function of bubble breaking and bubble inhibition, and because it uses water as the solvent, it has good washability.

It is an economic and environmental friendly defoamer with low COD and BOD, and it is a suitable choice for PCB customers who are afraid of silica and oil.

•Suitable for wet process

Screen Printing Cleaner

At present, most of the industry uses BCS for screen cleaning, but now our company has developed a screen cleaning solution to replace BCS, which is very effective in cleaning the screen of various printing inks including conductive silver paste.

1.Solubility to various inks.

2.Mild taste.

3.Low volatility.

4.Will not attack the skin.

5.Superior to anti-white water (BCS).

Peelable

Fast curing speed, excellent delamination after curing, high toughness, not easy to residual glue.

Wide operating range, good heat and chemical resistance, suitable for IT0 film and ITO glass of touch panel.

(This product should be left for 4 hours after printing and baking, it can resist static electricity and effectively reduce the problem of static electricity breakdown when removed.)

Antioxidant

ENTEK Cu-106A(OSP) (antioxidant) can be used in KOH, NaOH system or alone to increase the speed of film removal and prevent oxidation of the copper surface, besides, it has good washability and the antioxidant layer can be easily removed after acid treatment without any effect on the post-processing.

SERVICES

SERVICES

Electronic Materials & Protective Films

Cleaning Tools

Chemical Solutions